Product Show
Gap Pad 3500ULM

Features and advantages ·Thermal conductivity coefficient: 3.5W ·Thickness of gasket material: 0.508mm/3.175mm ·Flame retardant grade: V-O ·Continuous use temperature: -60 ℃+200 ℃ ·Insulation breakdown voltage: > 5000V ·Highly integrated and maintaining structural integrity with extremely low compressive stress ·Glass fiber reinforced puncture, shear, and tear resistance ·Non fiberglass options for reducing pressure required in applications

View More
Gap Pad 3004SF

Features and advantages ·Thermal conductivity coefficient: 3.0W ·Thickness of gasket material: 0.245mm/3.175mm ·Flame retardant grade: V-O ·Continuous use temperature: -40 ℃+125 ℃ ·Insulation breakdown voltage: > 6000V ·Silicon free formula

View More
Gap Pad 2202SF

Features and advantages ·Thermal conductivity: 2 W ·Silicon free formula ·Minimum compressed set ·0.5mm film provides a non sticky surface ·The tacky side can be handled and placed easily

View More
Gap Pad VO, GAP PAD TGP 800VO

View More
Gap Pad 1500, GAP PAD TGP 1500

Features and advantages ·Thermal conductivity: 1.5W ·Thermal impedance: 1.33 ℃ - in2/W (@ 30psi) ·Thickness of gasket material: 0.508mm -5.08mm ·Flame retardant grade: V-O ·Continuous use temperature:? 60℃+200℃ ·Insulation breakdown voltage: > 6000V ·Soft and low hardness

View More
Gap Pad 1500R, GAP PAD TGP 1500R

The GapPad 1500R gap pad has the same highly integrated, low modulus polymer, and glass fiber reinforced material treatment is easy to increase the allowable puncture, shear, and tear. The natural nails on both sides of the material allow for good compliance on the mating surface of the parts, further reducing thermal resistance.

View More
Shenzhen YHD Electronics Co., Ltd

contact number:0755-33137976 18681433246

Enterprise Mailbox:languoxiong522@126.com

company address:Building 2, baishixia New Development Zone, Fuyong, Bao'an District, Shenzhen

Wechat QR code
Copyright © 2021 深圳友和德电子有限公司版权所有 粤ICP备2021092259号-1
Shenzhen YHD Electronics Co., Ltd

0755-33137976

SUCCESS SUBMIT!

OK

Mail sent!

OK

SUCCESS SUBMIT!

OK