Gap Pad 3500ULM
Features and advantages
·Thermal conductivity coefficient: 3.5W
·Thickness of gasket material: 0.508mm/3.175mm
·Flame retardant grade: V-O
·Continuous use temperature: -60 ℃+200 ℃
·Insulation breakdown voltage: ＞ 5000V
·Highly integrated and maintaining structural integrity with extremely low compressive stress
·Glass fiber reinforced puncture, shear, and tear resistance
·Non fiberglass options for reducing pressure required in applications
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Telephone：0755-33137976
Telephone：0755-33137976Product Details
Gap Pad 3500ULM (ultra-low modulus of elasticity) is an extremely soft gap filling material with a thermal conductivity of 3.5 W/m-K. The rated power of this material provides excellent thermal conductivity at low pressures due to its unique 3.5 W/m-K filling package and ultra-low modulus resin formula. Enhanced materials are highly suitable for high-performance applications that require extremely low assembly stress. The Gap Pad 3500ULM maintains excellent interface and wet discharge characteristics, even adhering to high surface roughness and uneven surfaces.
The Gap Pad 3500ULM provides materials with no glass fiber and high natural inherent viscosity, eliminating the side of the thermal barrier adhesive layer. Easy and convenient to operate. The Gap Pad 3500ULM is provided with protective lining on both sides.
Typical applications include
· consumer electronics
· telecom
· Asic AND Dsp
· PC application program
Typical applications include
· consumer electronics
· telecom
· Asic AND Dsp
· PC application program
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Shenzhen YHD Electronics Co., Ltd
0755-33137976
