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Gap Pad 3500ULM

Features and advantages ·Thermal conductivity coefficient: 3.5W ·Thickness of gasket material: 0.508mm/3.175mm ·Flame retardant grade: V-O ·Continuous use temperature: -60 ℃+200 ℃ ·Insulation breakdown voltage: > 5000V ·Highly integrated and maintaining structural integrity with extremely low compressive stress ·Glass fiber reinforced puncture, shear, and tear resistance ·Non fiberglass options for reducing pressure required in applications

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Gap Pad 3004SF

Features and advantages ·Thermal conductivity coefficient: 3.0W ·Thickness of gasket material: 0.245mm/3.175mm ·Flame retardant grade: V-O ·Continuous use temperature: -40 ℃+125 ℃ ·Insulation breakdown voltage: > 6000V ·Silicon free formula

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Gap Pad 2202SF

Features and advantages ·Thermal conductivity: 2 W ·Silicon free formula ·Minimum compressed set ·0.5mm film provides a non sticky surface ·The tacky side can be handled and placed easily

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Shenzhen YHD Electronics Co., Ltd

contact number:0755-33137976 18681433246

Enterprise Mailbox:languoxiong522@126.com

company address:Building 2, baishixia New Development Zone, Fuyong, Bao'an District, Shenzhen

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Shenzhen YHD Electronics Co., Ltd

0755-33137976

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