The GapPad 1500R gap pad has the same highly integrated, low modulus polymer, and glass fiber reinforced material treatment is easy to increase the allowable puncture, shear, and tear. The natural nails on both sides of the material allow for good compliance on the mating surface of the parts, further reducing thermal resistance. 

Note: The thickness obtained is defined as the final application layer thickness.

·       Typical applications include

·       telecom

·       Computers and peripherals

·       Power conversion

·       Memory module/chip level packaging of RDRAM

·       Regional heat needs to be transferred to a frame chassis or other types of radiators