It is widely used in radiator bottom or frame, set-top box, power supply and vehicle storage battery, charging pile, LED TV, LED lamps, RDRAM memory module, micro heat pipe radiator, RDRAM memory module and other products.

It is widely used in radiator bottom or frame, set-top box, power supply and vehicle storage battery, charging pile, LED TV, LED lamps, RDRAM memory module, micro heat pipe radiator, RDRAM memory module and other products.

It is widely used in radiator bottom or frame, set-top box, power supply and vehicle storage battery, charging pile, LED TV, LED lamps, RDRAM memory module, micro heat pipe radiator, RDRAM memory module and other products.

Nicom700hu series heat conduction interface materials are used to fill the air gap between heating devices and heat sinks or metal bases. Their flexible and elastic characteristics enable them to be used to fill very uneven surfaces. Its excellent performance enables heat to be transmitted from the heating device or the whole PCB to the metal shell or diffusion plate, so as to improve the efficiency and service life of heating electronic components.

Nicom800hp series heat conduction interface materials are used to fill the air gap between heating devices and heat sinks or metal bases. Their flexible and elastic characteristics enable them to be used to cover very uneven surfaces. Its excellent performance enables heat to be transmitted from the heating device or the whole PCB to the metal shell or diffusion plate, so as to improve the efficiency and service life of heating electronic components.

Nicom200 series heat conduction interface materials are used to fill the air gap between heating devices and heat sinks or metal bases. Their flexible and elastic characteristics enable them to cover very uneven surfaces. Its excellent performance enables heat to be transmitted from the heating device or the whole PCB to the metal shell or diffusion plate, so as to improve the efficiency and service life of heating electronic components.