Gap Pad VO is an economical and efficient thermal conductivity interface. This material is a rubber coated fiberglass carrier that provides a filled thermal conductive polymer for material processing.
The fit of Gap Pad VO creates an air gap between the PC board and the heat sink or metal base.
Note: The thickness of the resultant force is defined as the final gap thickness of the application
Typical applications include

·   Telecommunications
·   Computers and peripherals
·     Power conversion
·     Between the heating semiconductor and a heat sink
·     The heat in the area needs to be transferred to a frame, chassis, or other type of radiator
·     Between the heating magnetic element and a heat sink