Gap Pad 1500, GAP PAD TGP 1500
Features and advantages
·Thermal conductivity: 1.5W
·Thermal impedance: 1.33 ℃ - in2/W (@ 30psi)
·Thickness of gasket material: 0.508mm -5.08mm
·Flame retardant grade: V-O
·Continuous use temperature:? 60℃+200℃
·Insulation breakdown voltage: ＞ 6000V
·Soft and low hardness
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Telephone：0755-33137976
Telephone：0755-33137976Product Details
The GapPad 1500 has an ideal filler mix, giving it a low modulus characteristic to maintain optimal thermal performance, and can also be easily processed. The natural adhesion on both sides of the material can adhere to adjacent surfaces with good adhesion, minimizing interfacial thermal resistance.
Note: The obtained thickness is defined as the final gap thickness of the application.
Typical applications include
· telecom
· Computers and peripherals
· Power conversion
· Memory module/chip level packaging of RDRAM
· In areas where heat needs to be transferred to the chassis of the frame, or other types of radiators
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Shenzhen YHD Electronics Co., Ltd
0755-33137976
