Gap Pad 2202SF
Features and advantages
·Thermal conductivity: 2 W
·Silicon free formula
·Minimum compressed set
·0.5mm film provides a non sticky surface
·The tacky side can be handled and placed easily
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Telephone：0755-33137976
Telephone：0755-33137976Product Details
Gap Pad 2202SF gap pad is a high-performance, 2 W/m, thermal conductive gap filling material. The Gap Pad 2202SF compound is designed from a silicone free resin and provides very low interface resistance to adjacent surfaces.
Gap Pad 2202SF is specifically designed for silicon sensitive applications. The structural characteristics of the material are that one side of the 0.5 mil PET film is naturally nailed to the other. The natural viscosity eliminates the need for an additional adhesive layer.
Typical applications
Hard drive
Optical applications
Set-top box
Gap Pad 2202SF is specifically designed for silicon sensitive applications. The structural characteristics of the material are that one side of the 0.5 mil PET film is naturally nailed to the other. The natural viscosity eliminates the need for an additional adhesive layer.
Typical applications
Hard drive
Optical applications
Set-top box
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Shenzhen YHD Electronics Co., Ltd
0755-33137976
