Gap Pad 3004SF
Features and advantages
·Thermal conductivity coefficient: 3.0W
·Thickness of gasket material: 0.245mm/3.175mm
·Flame retardant grade: V-O
·Continuous use temperature: -40 ℃+125 ℃
·Insulation breakdown voltage: ＞ 6000V
·Silicon free formula
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Telephone：0755-33137976
Telephone：0755-33137976Product Details
The Gap Pad 3004SF gap pad is a high-performance 3 W/m thermal gap filling material. The design of the Gap Pad 3004SF gap pad is silicone free and provides extremely low interface resistance adjacent to the surface. The GapPad 3004SF is specifically designed for silicon sensitive applications.
Typical applications
· Hard drive
· Hard drive box tray
· Hard disk/SSD drive combination
· Automotive Electronics
· medical apparatus and instruments
· solar energy
· optical element
· Luminous lighting
· Laser optics
Typical applications
· Hard drive
· Hard drive box tray
· Hard disk/SSD drive combination
· Automotive Electronics
· medical apparatus and instruments
· solar energy
· optical element
· Luminous lighting
· Laser optics
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Shenzhen YHD Electronics Co., Ltd
0755-33137976
