Nicom400 series heat conduction interface materials are used to fill the air gap between heating devices and heat sinks or metal bases. Their flexible and elastic characteristics enable them to cover very uneven surfaces. Its excellent performance enables heat to be transmitted from the heating device or the whole PCB to the metal shell or diffusion plate, so as to improve the efficiency and service life of heating electronic components. 报错 笔记

Nicom300 series heat conduction interface materials are used to fill the air gap between heating devices and heat sinks or metal bases. Their flexible and elastic characteristics enable them to be used to cover very uneven surfaces. Its excellent performance enables heat to be transmitted from the heating device or the whole PCB to the metal shell or diffusion plate, so as to improve the efficiency and service life of heating electronic components. It can provide a variety of thickness options, compressibility, long service life and stable performance.

Nicom500 series heat conduction interface materials are used to fill the air gap between heating devices and heat sinks or metal bases. Their flexible and elastic characteristics enable them to be used to cover very uneven surfaces. Its excellent performance enables heat to be transmitted from the heating device or the whole PCB to the metal shell or diffusion plate, so as to improve the efficiency and service life of heating electronic components.

Nicom92500 series heat conduction interface materials are used to fill the air gap between heating devices and heat sinks or metal bases. Their flexible and elastic characteristics enable them to be used to cover very uneven surfaces. Its excellent performance enables heat to be transmitted from the heating device or the whole PCB to the metal shell or diffusion plate, so as to improve the efficiency and service life of heating electronic components.

Nicom500s series heat conduction interface materials are used to fill the air gap between heating devices and heat sinks or metal bases. Their flexible and elastic characteristics enable them to cover very uneven surfaces. Its excellent performance enables heat to be transmitted from the heating device or the whole PCB to the metal shell or diffusion plate, so as to improve the efficiency and service life of heating electronic components.