At present, one of the common heat dissipation methods of most compact electronic products is to use heat dissipation module to dissipate heat. What is a cooling module? In short, it is a heat dissipation channel composed of a radiator and a heat conducting material, and sometimes includes a heat dissipation fan. In the heat dissipation module, heat conducting silica gel sheet and other similar products are mostly used to assist heat dissipation, so as to achieve better heat dissipation effect.

The selection of thermal conductive silicon film in the heat dissipation module shall be determined according to the specific situation. For example, the thermal conductivity of thermal conductive silicon film shall be determined according to the temperature difference and heat dissipation effect, and the thickness of thermal conductive silica gel sheet shall be selected according to the actual product gap. Thermal conductivity and thickness selection of thermal conductive silicon film.
       Selection of thickness and thermal conductivity of thermal conductive silica gel sheet：
       1、There are many thermal conductivity of thermal conductive silicon film, ranging from 1.5W to 13W, which can generally meet the cooling required by the product. The thermal conductivity does not need to be too high. In the face of general electronic products, thermal conductivity is no problem, and the price is not very expensive, and the thermal conductivity effect is also very good.

2、For the thickness of thermal conductive silicon film, the customer usually selects the corresponding thickness according to the actual gap size of the product, which is correct. For example, if the gap of the product is 1.5mm, most customers directly choose 1.5mm thermal conductive silica gel sheet, but the actual application effect is not very ideal. In fact, as long as we change the thickness of the product a little, the thermal conductive effect will be significantly improved. Generally, 2.0mm thermal conductive silica gel sheet shall be used for the product with a gap of 1.5mm. Because the thermal conductive silica gel sheet itself is very soft and has good compressibility, the compression ratio must be considered when selecting the thickness of thermal conductive silica film.

Note: the selection of thermal conductive silica gel sheet is not that the higher the thermal conductivity is, the better, but to select the appropriate thermal conductive material according to the actual product situation. It is not very expensive or very good. The right and appropriate is the good choice.