Introduction
Yhd-a800al series products are widely used to bond heat sinks to microprocessors and other power consuming semiconductors. These tapes have strong bonding strength and low thermal impedance, which can effectively replace grease and mechanical fixation.
Features
- The thermal conductivity is 1.6w/mk
- High performance heat conduction acrylic adhesive
- High adhesive strength double-sided pressure-sensitive tape for various surfaces
Application
Fix the heat sink on the encapsulated chip; Fix the radiator on the power supply circuit board or vehicle control circuit board; It can replace hot melt adhesive, screw, fastener and other fixing methods.
Parameters
Characteristic table | ||||||||
Product model | YHD-A806AL | YHD-A808AL | YHD-A810AL | test method | ||||
colour | white | visual | ||||||
Adhesive type | Acrylic adhesive | ********** | ||||||
Substrate type | aluminum foil | ********** | ||||||
Operating temperature range | -45°C to 120 °C | ********** | ||||||
thickness | 0.006"0.152mm | 0.008"0.203mm | 0.010" 0.254mm | ASTM D374 | ||||
breakdown voltage | > 1000 Vac | > 1200 Vac | > 1500 Vac | ASTM D149 | ||||
Thermal conductivity | 1.6 W/mK | ASTM D5470 | ||||||
180°Peel stubbornness | > 1200 g/inch (Steel, Immediate) | PSTC-1 | ||||||
180°Peel stubbornness | >1400 g/inch (Steel after 24 hrs) | PSTC-1 | ||||||
Retention 25 °C/Hours | > 48 Hours | PSTC-7 | ||||||
Retention 80 °C/Hours | > 48 Hours | PSTC-7 |
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Standard thickness:
0.006"(0.152mm)、0.008"(0.203mm)、0.010"(0.254mm)
If you need different thickness, please contact our company.
Standard size:
16" x 100'(406mm x 30.48M)TIA800ALseries can be die cut into different shapes.<
Reinforcement material:
YHD-A800ALseries coiled material can be reinforced with glass label.。
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