YHD-A800AL
Fix the heat sink on the encapsulated chip; Fix the radiator on the power supply circuit board or vehicle control circuit board; It can replace hot melt adhesive, screw, fastener and other fixing methods.
Book now
Telephone:0755-33137976
Product Details

Introduction

Yhd-a800al series products are widely used to bond heat sinks to microprocessors and other power consuming semiconductors. These tapes have strong bonding strength and low thermal impedance, which can effectively replace grease and mechanical fixation.

Features

  • The thermal conductivity is 1.6w/mk
  • High performance heat conduction acrylic adhesive
  • High adhesive strength double-sided pressure-sensitive tape for various surfaces
 

 

Application

Fix the heat sink on the encapsulated chip; Fix the radiator on the power supply circuit board or vehicle control circuit board; It can replace hot melt adhesive, screw, fastener and other fixing methods.

Parameters

Characteristic table
Product model YHD-A806AL YHD-A808AL YHD-A810AL test method
colour white visual
Adhesive type Acrylic adhesive **********
Substrate type aluminum foil **********
Operating temperature range -45°C to 120 °C **********
thickness 0.006"0.152mm 0.008"0.203mm 0.010" 0.254mm ASTM D374
breakdown voltage > 1000 Vac > 1200 Vac > 1500 Vac ASTM D149
Thermal conductivity 1.6 W/mK ASTM D5470
180°Peel stubbornness > 1200 g/inch (Steel, Immediate) PSTC-1
180°Peel stubbornness >1400 g/inch (Steel after 24 hrs) PSTC-1
Retention 25 °C/Hours > 48 Hours PSTC-7
Retention 80 °C/Hours > 48 Hours PSTC-7
 

Standard thickness:

0.006"(0.152mm)、0.008"(0.203mm)、0.010"(0.254mm)

If you need different thickness, please contact our company.

Standard size:

16" x 100'(406mm x 30.48M)TIA800ALseries can be die cut into different shapes.<

Reinforcement material:

YHD-A800ALseries coiled material can be reinforced with glass label.。

 
 
Please leave your contact information!
Send Email!
Shenzhen YHD Electronics Co., Ltd

0755-33137976

SUCCESS SUBMIT!

OK

Mail sent!

OK

SUCCESS SUBMIT!

OK