Telephone：0755-33137976Introduction
Yhd-a600p series fireproof and thermal conductive double-sided adhesive and heat dissipation double-sided adhesive products are widely used to bond heat sinks to microprocessors and other power consuming semiconductors. These adhesive tapes have strong bonding strength and low thermal impedance, which can effectively replace grease and mechanical fixation
Features
- The thermal conductivity is 0.8w/mk
- High performance heat conduction acrylic adhesive
- High adhesive strength double-sided pressure-sensitive tape for various surfaces
Application
Fix the heat sink on the encapsulated chip; Fix the radiator on the power supply circuit board or vehicle control circuit board; It can replace hot melt adhesive, screw, fastener and other fixing methods.
Parameters
| Characteristic table | ||||
| colour | white | visual | ||
| Adhesive type | Acrylic adhesive | ********** | ||
| Substrate type | PET | ********** | ||
| Operating temperature range | -45 °C to 120 °C | ********** | ||
| thickness |
0.0050"0.010mm |
ASTM D374 | ||
| breakdown voltage | > 1000 Vac | ASTM D149 | ||
| Thermal conductivity | 0.8 W/mK | ASTM D5470 | ||
| 180°peel strength | > 800 g/inch (Steel, Immediate) | PSTC-1 | ||
| 180°peel strength | > 1000 g/inch (Steel after 24 hrs) | PSTC-1 | ||
| peel strength 25 °C/Hours | > 4 Hours | PSTC-7 | ||
| peel strength 80 °C/Hours | > 4 Hours | PSTC-7 | ||
| Fire rating | 94V0 | UL E331100 | ||
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Standard thickness:
YHD-A605P：0.005"(0.127mm) YHD-A608P：0.008"(0.203mm) YHD-A610P：0.010"(0.254mm)
If you need different thickness, please contact our company.
Standard size:
40" x 100'(1016mm x 30.48M)TIA600Pseries can be die cut into different shapes.
Reinforcement material:
YHD-A600Pseries coiled material can be reinforced with glass label.
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